Title:
基板処理装置及び基板処理方法
Document Type and Number:
Japanese Patent JP7442347
Kind Code:
B2
Abstract:
A substrate processing apparatus includes a processing chamber where a substrate support on which a substrate is placed and a target holder configured to hold a target are disposed, a freezing device disposed with a gap with respect to a bottom surface of the substrate support and having a chiller and a cold heat medium laminated on the chiller, and a rotating device configured to rotate the substrate support. The substrate processing apparatus further includes a first elevating device configured to raise and lower the substrate support, a coolant channel formed in the chiller to supply a coolant to the gap, and a cold heat transfer material disposed in the gap and being in contact with the substrate support and the cold heat medium so as to transfer heat therebetween.
Inventors:
Nakagawanishi Manabu
Koji Maeda
Shinji Imoto
Motoo Yamagata
Koji Maeda
Shinji Imoto
Motoo Yamagata
Application Number:
JP2020039064A
Publication Date:
March 04, 2024
Filing Date:
March 06, 2020
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
C23C14/34; H01L21/683
Domestic Patent References:
| JP2010168635A | ||||
| JP2012111823A | ||||
| JP2016135841A |
Foreign References:
| WO2017221631A1 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito