Title:
SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
Japanese Patent JP2023046743
Kind Code:
A
Abstract:
To provide a substrate processing apparatus which can suppress processing fluid from having a high temperature due to heat generation of a motor.SOLUTION: A substrate processing apparatus 100 includes a processing unit 1, a fluid box 100B, and a cooling gas supply section 300. The processing unit 1 supplies processing fluid to a substrate W and processes the substrate W. The fluid box 100B supplies processing fluid to the processing unit 1. The cooling gas supply section 300 is arranged within the fluid box 100B. The fluid box 100B has valves 211 and 221 for opening/closing a passing route of processing fluid and motors 212 and 222 for driving the valves 211 and 221. The cooling gas supply section 300 blows out cooling gas so as to pass side faces 212a and 222a of the motors 212 and 222.SELECTED DRAWING: Figure 5
Inventors:
YAMANOCHI YUTA
ENDO TORU
AOKI RIKUTA
ENDO TORU
AOKI RIKUTA
Application Number:
JP2021155513A
Publication Date:
April 05, 2023
Filing Date:
September 24, 2021
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD
International Classes:
H01L21/027; H01L21/304
Attorney, Agent or Firm:
Hiroyuki Maei
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