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Title:
基板処理装置
Document Type and Number:
Japanese Patent JP7325283
Kind Code:
B2
Abstract:
To suppress deformation of a substrate when the substrate rotates.SOLUTION: A substrate processing apparatus (1) includes a substrate holding unit (120) that rotates while holding a substrate (W) horizontally. The substrate holding unit (120) includes a spin base (121), a chuck pin (122), and a rotation mechanism (124). The spin base (121) has a first main surface (121a) facing the substrate (W), a second main surface (121b), and a side surface (121c) communicating with the first main surface (121a) and the second main surface (121b). The spin base (121) has a first end portion (121La) provided on the first main surface (121a), a second end portion (121Lb) provided on either the second main surface (121b) or the side surface (121c), and a flow path (121L) that communicates with the first end portion (121La) and the second end portion (121Lb).SELECTED DRAWING: Figure 2

Inventors:
Nobuaki Okita
Application Number:
JP2019176703A
Publication Date:
August 14, 2023
Filing Date:
September 27, 2019
Export Citation:
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Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/304; H01L21/306; H01L21/683
Domestic Patent References:
JP2013187490A
JP2000105076A
JP2006157008A
JP3011749A
JP2015506588A
JP10135178A
Foreign References:
US20130233361
Attorney, Agent or Firm:
Hiroyuki Maei



 
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