Title:
基板処理方法、基板処理装置および基板処理システム
Document Type and Number:
Japanese Patent JP7142461
Kind Code:
B2
Abstract:
There is provided a method of processing a substrate, the method including: a production process of producing B(OH3) or B2O3 by bringing an oxidizing agent into contact with a boron-based film in a substrate in which the boron-based film is formed on a film including a silicon-based film; and a removal process of removing the boron-based film from the substrate by dissolving the B(OH3) or B2O3 produced in the production process in water.
Inventors:
Koji Kagawa
Application Number:
JP2018092753A
Publication Date:
September 27, 2022
Filing Date:
May 14, 2018
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/304; H01L21/308
Domestic Patent References:
| JP2013533376A | ||||
| JP7183247A |
Foreign References:
| US9484256 | ||||
| WO2016088731A1 |
Attorney, Agent or Firm:
Sakai International Patent Office