Title:
基板処理方法及び基板処理装置
Document Type and Number:
Japanese Patent JP7176361
Kind Code:
B2
Abstract:
To suppress scratch on a rear face of a substrate treated by being adsorbed by an electrostatic chuck, and vibration upon release of adsorption.SOLUTION: A substrate treatment method includes a first temperature adjustment step for adjusting a temperature of an electrostatic chuck having a plurality of projections provided in a vacuum vessel, a treatment step for performing a vacuum treatment of a substrate by adsorbing a rear face of the substrate onto the plurality of projections of the electrostatic chuck having an adjusted temperature, and a second temperature adjustment step for adjusting the temperature of the substrate before being placed on the electrostatic chuck, by a temperature adjustment part different from the electrostatic chuck, in order to reduce a difference between the temperature of the substrate and a temperature of the electrostatic chuck when the substrate is adsorbed onto the electrostatic chuck.SELECTED DRAWING: Figure 8
Inventors:
海▲瀬▼ 拓也
Hiroaki Chihaya
Hiroaki Chihaya
Application Number:
JP2018209893A
Publication Date:
November 22, 2022
Filing Date:
November 07, 2018
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
C23C14/34; C23C14/02; C23C16/46; H01L21/205; H01L21/3065; H01L21/683
Domestic Patent References:
| JP2017527115A | ||||
| JP1185176A | ||||
| JP2000012664A | ||||
| JP2002009141A | ||||
| JP7142408A | ||||
| JP11330218A | ||||
| JP2007217733A | ||||
| JP2017120841A |
Attorney, Agent or Firm:
Patent Attorney Corporation Yayoi Patent Office