Title:
基板処理方法、基板処理装置およびコンピュータ読み取り可能な記録媒体
Document Type and Number:
Japanese Patent JP4811877
Kind Code:
B2
Abstract:
A substrate processing method which removes an ArF resist film from a wafer having the ArF resist film. As an ultraviolet irradiation process is performed on the ArF resist film, and then an ozone gas and water vapor are fed to the ArF resist film, the ArF resist film is altered in a water-soluble state. Thereafter, the ArF resist film is removed from the substrate by feeding pure water to the ArF resist film altered into the water-soluble state.
Inventors:
Takayuki Toshima
Tadashi Iino
Yusuke Saito
Mitsunori Nakamori
Noriomi Uchida
Takehiko Orii
Tadashi Iino
Yusuke Saito
Mitsunori Nakamori
Noriomi Uchida
Takehiko Orii
Application Number:
JP2008155288A
Publication Date:
November 09, 2011
Filing Date:
June 13, 2008
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/027; G03F7/42; H01L21/304; H01L21/3065; H01L21/311
Domestic Patent References:
| JP2002231696A | ||||
| JP2002134401A | ||||
| JP2001223206A | ||||
| JP2002018379A | ||||
| JP2003332322A | ||||
| JP2003273085A |
Attorney, Agent or Firm:
Hiroshi Takayama