Title:
SUBSTRATE PROCESSING SYSTEM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING DEVICE, AND PROGRAM
Document Type and Number:
Japanese Patent JP2019125736
Kind Code:
A
Abstract:
PURPOSE: To provide a technology for achieving high-efficiency production management.SOLUTION: Provided is a technology that has: a substrate processing device that comprises a reactor for processing a substrate, a transportation chamber adjacent to the reactor, a detector for detecting a state of the transportation chamber or the reactor as device monitor information, a common mobile terminal authentication unit for authenticating information from a common mobile terminal, and a first transmission/reception unit for transmitting device information including a device management number and the device monitor information to the common mobile terminal; and the common mobile terminal that comprises a second transmission/reception unit for receiving the device information, and a display unit for displaying the device information.SELECTED DRAWING: Figure 2
Inventors:
MIZUGUCHI YASUHIRO
KIKUCHI TOSHIYUKI
OHASHI TADASHI
TAKASAKI TADASHI
MATSUI SHUN
KIKUCHI TOSHIYUKI
OHASHI TADASHI
TAKASAKI TADASHI
MATSUI SHUN
Application Number:
JP2018006405A
Publication Date:
July 25, 2019
Filing Date:
January 18, 2018
Export Citation:
Assignee:
KOKUSAI ELECTRIC CORP
International Classes:
H01L21/02; B65G49/00; G05B19/418; H01L21/31; H01L21/677