To provide a substrate processor capable of putting in order of the directions of all substrates to be delivered to respective processing parts.

This substrate processor is provided with a wafer edge exposure device 20 as one of the processing parts. This wafer edge exposure device 20 is provided with a substrate holding base 22 rotatably holding the substrate and an edge sensor 30 detecting the periclinal positions of the substrate. The substrates fed to the wafer edge exposure device 20, after the whole rotatable reference parts are position-corrected to make the positions thereof put in order, are taken out of the wafer edge exposure device 20 to be fed to other processing parts. Through these procedures, the positions of the rotatable reference part of the whole substrates are controlled to be specified inside the title substrate processor.