PURPOSE: To improve heating efficiency of a substrate by constituting a substrate support of an inorganic substance having higher thermal conductivity than quartz glass together with high transmittivity of infrared rays.

CONSTITUTION: A subject substrate support is constituted of an inorganic substance having more than 5W/m.k of thermal conductivity besides transmitting infrared rays all of wavelength 7W30μm or of a partial wavelength region. For instance, thermal conductivity of alumina is 36W46W/m.k higher than thermal conductivity of quartz glass besides transmitting infrared rays of 7W8.5μm, which is a part of wavelength absorbed by a silicon substrate. This alumina is used as the substrate support 5 of a thin film formation device. Thereby, heating efficiency of the substrate 4 can be heightened. For instance, when a tungsten film is formed on the silicon substrate 4 using this support 5, high piling-up speed can be obtained because of being able to heat the substrate 4 up to high temperature.