Title:
SUBSTRATE SUPPORT DEVICE AND SUBSTRATE TREATMENT DEVICE
Document Type and Number:
Japanese Patent JP2015206558
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate support device and a substrate treatment device including the substrate support device capable of preventing heat of the supporting pins from being concentrically applied to a predetermined location in each of the substrate to be treated even for a short period of time and further capable of preventing pin marks from being generated at the substrate after its treatment such as heating.SOLUTION: This invention relates to a substrate support device and a substrate treatment device. The substrate support device comprises: a plurality of supporting pins fixed to a hot plate; oscillation means for oscillating a substrate to be treated in a two-dimensional manner while its lower surface being contacted with the upper end part of each of the supporting pins; and control means for controlling the oscillation means in such a way that the substrate may not be fixedly positioned while a specified location at the lower surface of the substrate is being contacted with the upper end of each of the supporting pins during treatment such as heating of the substrate. Each of the supporting pins is prevented from being continuously contacted with the same location in the lower surface of the substrate and heat transferred from each of the supporting pins is not concentrated at the specified location in the substrate.
Inventors:
YAMAGUCHI SHINJI
SAKKA NAOHIKO
AMAMOTO KEIGO
SAKKA NAOHIKO
AMAMOTO KEIGO
Application Number:
JP2014088157A
Publication Date:
November 19, 2015
Filing Date:
April 22, 2014
Export Citation:
Assignee:
KOWA CO
International Classes:
F26B9/06; F26B23/06; G02F1/13; G09F9/00; H01L21/683
Attorney, Agent or Firm:
Masanobu Kureda