Title:
SUBSTRATE SUPPORT UNIT, AND SUBSTRATE PROCESSING APPARATUS EQUIPPED WITH THE SUBSTRATE SUPPORT UNIT, AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2008166792
Kind Code:
A
Abstract:
To provide a substrate support unit that can improve the substrate processing efficiency at processings.
This substrate support unit performs the processing to float and rotate the substrate from the top of a chuck plate, by providing a rotating flow to the substrate at processings. Consequently, the present invention supports the substrate by making it float from the top of a chuck plate by a noncontact method at processings, and make it rotate at the processing speed.
Inventors:
LEE TAKUYOPU
KIM HOSHU
KIM HOSHU
Application Number:
JP2007334683A
Publication Date:
July 17, 2008
Filing Date:
December 26, 2007
Export Citation:
Assignee:
SEMES CO LTD
International Classes:
H01L21/683; B05C11/08; H01L21/304; H01L21/306
Domestic Patent References:
| JPS58106543A | 1983-06-24 | |||
| JP2002064130A | 2002-02-28 |
Attorney, Agent or Firm:
Masatake Shiga
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro
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