Title:
SUBSTRATE TERMINAL BONDING STRUCTURE AND TERMINAL BONDING METHOD
Document Type and Number:
Japanese Patent JP2022168539
Kind Code:
A
Abstract:
To solve a problem in a conventional substrate terminal connection structure in which it may be difficult to check the finished solder and there is a demand for a reduction in manufacturing costs.SOLUTION: A structure in which a circuit board 1 and a signal terminal 2 extending in its thickness direction are ultrasonically bonded has a configuration in which a signal terminal 2 which has a bonding groove 3 penetrating in the thickness direction at the end of the circuit board 1 and a land film 4 on the inner surface of the bonding groove 3 and is engaged with the bonding groove 3, and a land film 4 of the bonding groove 3 are ultrasonically bonded. Thus, also in the manufacture of an electronic device having an electronic device P adjacent to the circuit board 1, the bonding state of the circuit board 1 and the signal terminal 2 can be easily confirmed, and the manufacturing cost can be reduced.SELECTED DRAWING: Figure 1
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Inventors:
MATSUMURA KOKI
Application Number:
JP2021074077A
Publication Date:
November 08, 2022
Filing Date:
April 26, 2021
Export Citation:
Assignee:
NISSAN MOTOR
International Classes:
H05K1/18; H05K1/11; H05K3/32; H05K3/40
Attorney, Agent or Firm:
Matoba
Hiroshi Suzuki
Hiroshi Suzuki