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Title:
基板搬送装置および基板搬送方法
Document Type and Number:
Japanese Patent JP7316033
Kind Code:
B2
Abstract:
To provide a substrate transfer device capable of suppressing bounce of a substrate at the time of delivering the substrate.SOLUTION: A substrate transfer device for loading a substrate on a loading surface comprises a substrate support body, a horizontal movement mechanism, a lifting mechanism, and a control unit. The substrate support body includes a substrate support part, a protrusion part, and a pressing part. The substrate support part supports a second region of an undersurface of the substrate, the second region differing from its first region supported by the loading surface. The protrusion part is erected on the substrate support part and includes an opposite surface facing the substrate's side surface. The pressing part presses the substrate to the protrusion part side to hold the substrate in cooperation with the protrusion part. The control unit makes the lifting mechanism lower the substrate support body from above the loading surface in a state in which pressing to the substrate by the pressing part is released and, at least after the substrate comes into contact with the loading surface, makes the horizontal movement mechanism move the substrate support body in a separation direction in which the opposite surface goes away from the substrate concurrently with the substrate support body lowering.SELECTED DRAWING: Figure 5

Inventors:
Takashi Tani
Yutaka Ogawa
Eiji Fukatsu
Application Number:
JP2018210377A
Publication Date:
July 27, 2023
Filing Date:
November 08, 2018
Export Citation:
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Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/677; B25J13/00
Domestic Patent References:
JP2013152998A
JP2009099918A
JP5144692A
JP2012074485A
JP2011159738A
Foreign References:
WO2011148560A1
WO2017104648A1
Attorney, Agent or Firm:
Hidetoshi Yoshitake
Takahiro Arita