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Title:
SUBSTRATE TREATING APPARATUS
Document Type and Number:
Japanese Patent JP3463916
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To supply a treating liquid of a concentration corresponding to mixing conditions stably to a substrate treating part.
SOLUTION: A chemical liquid is introduced from a chemical liquid introduction passage 23 Qn (Q1, Q2,...Qn max) into a mixing part 22 in a pure water supply passage 21 by a quantitative pump 25Qn (Q1, Q2,...Qn max). The amount of pure water being supplied to the mixing part 22 is being measured by a pure water flow rate sensor 24. A controller 26 controls the pump 25Qn so that the chemical liquid to be mixed with pure water is introduced into the mixing part 22 in an introduction flow rate corresponding to the flow rate of pure water being supplied to the mixing part 22 and mixing conditions, monitors the present flow rate of pure water obtained from a pure water flow rate sensor 24, when the flow rate of pure water changes, calculates the introduction flow rate of the chemical liquid to be mixed with pure water based on the present flow rate of pure water being supplied to the mixing part 22 and the mixing conditions, and changes the control of the pump 25Qn to introduce the chemical liquid to be mixed with pure water into the mixing part 22 at the introduction flow rate.


Inventors:
Akihiko Morita
Application Number:
JP14000698A
Publication Date:
November 05, 2003
Filing Date:
May 21, 1998
Export Citation:
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Assignee:
Dainippon Screen Mfg. Co., Ltd.
International Classes:
B08B3/04; B01F3/08; B01F15/04; G05D11/02; H01L21/304; (IPC1-7): B08B3/04; B01F3/08; B01F15/04; G05D11/02; H01L21/304
Domestic Patent References:
JP9260333A
JP1070101A
JP8112587A
JP631151A
Attorney, Agent or Firm:
Tsutomu Sugitani



 
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