To provide a substrate treatment apparatus which provides enhanced quality of treated article and further is advantageous for miniaturization.

In the apparatus, pure water after rinsing (rinsing liquid after treating) is sucked by drain tube walls 2, 4 equipped on a feeding/sucking balanced type washing nozzle head 10, and immediately removed from the substrate; gas (dry gas after treating) containing the rinsing liquid after rinsing is sucked by exhausting tube walls 6, 8 equipped on a feeding/sucking balanced type air knife head 20, and immediately removed from the substrate. Thus, the rinsing liquid after rinsing does not splash to adhere to the substrate surface dried by the head 20, while the drained rinsing liquid after treating does not splash to adhere to the substrate surface dried by the head 10. Consequently, both heads 10, 20 can be adjacently disposed to miniaturize the apparatus, and re-adhesion of contaminant to the substrate W is surely prevented to enhance the quality of treated substrate W.