To enhance processing capability as an apparatus by employing batch processing with high productivity and further to make it possible to form plated films with uniform thickness with good selectability when using the apparatus as an electroless plating apparatus.
The substrate treatment apparatus has a processing tank 10 for holding a processing liquid, a substrate holder 16 for holding a plurality of substrates W and immersing the same in the processing liquid Q in the processing tank 10, a temperature control section 52 for controlling the temperature of the processing liquid Q in the processing tank 10, a processing liquid circulation system 40, 42, 44 for circulating the processing liquid Q in the processing tank 10, and rotating mechanisms 26, 28, 30, 32 for rotating the substrate holder 16 in the processing liquid Q in the processing tank 10 while holding the plurality of the substrates W.
KURASHINA KEIICHI
Ryoji Kosugi
Tetsuya Hirosawa