Title:
SUBSTRATE TREATMENT DEVICE AND ITS OPERATION METHOD
Document Type and Number:
Japanese Patent JP3728201
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To make a lowered pressure recover its original positive pressure state rapidly, for preventing atmosphere at a clean rood side of low cleanliness from getting into a housing, and to keep the positive pressure even at power outage.
SOLUTION: In a cassette station, a blast flow rate of air into the inside is made larger than an exhaust flow rate to realize positive pressure state, and a pressure is monitored by a manometer. During delivery of a wafer, an inner pressure is lowered as an opening part is opened; however, a control unit reduces the exhaust flow rate, so that inner pressure recovers its original pressure when lowering of pressure is recognized. After treatment is finished, an opening part is closed as a wafer is returned to a cassette and thus even though the inner pressure rises instantaneously, however, an exhaust flow rate is increased this time, and a pressure is returned to its original values. At power outage, an exhaust side is stopped, however, since a blast side is connected to a non-power outage power supply part, the positive pressure state is maintained.
Inventors:
Shigeaki Iida
Application Number:
JP2000383596A
Publication Date:
December 21, 2005
Filing Date:
December 18, 2000
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
G03F7/30; H01L21/027; (IPC1-7): H01L21/027; G03F7/30
Domestic Patent References:
| JP10125763A | ||||
| JP2000182949A | ||||
| JP5199680A | ||||
| JP2097239A |
Attorney, Agent or Firm:
Toshio Inoue
Mizuno Hiromi
Mizuno Hiromi
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