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Title:
SUBSTRATE TREATMENT DEVICE
Document Type and Number:
Japanese Patent JP2003022978
Kind Code:
A
Abstract:

To provide a substrate treatment device with which accurate control is enabled without vibration and the adjustment of a control system is facilitated even in a heat treatment furnace mutually strongly interfering a plurality of detected temperatures provided respectively corresponding to a plurality of heaters.

Measured temperatures in a plurality of zones are respectively compared with temperature setting values c1-c3 of a plurality of heaters h1-h3 by adders d1-d3, the respective compared results are inputted to a plurality of control units f1-f3, power control signals a1-a3 are operated and the ratio of interference in each of zones is multiplied to the respective operated power control signals a1-a3 by an interference ratio operating part 20 so that a final power control signal can be provided.


Inventors:
YAMAGUCHI HIDETO
UENO MASAAKI
Application Number:
JP2001209875A
Publication Date:
January 24, 2003
Filing Date:
July 10, 2001
Export Citation:
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Assignee:
HITACHI INT ELECTRIC INC
International Classes:
F27D19/00; G05B11/32; G05D23/00; H01L21/205; (IPC1-7): H01L21/205; F27D19/00; G05B11/32; G05D23/00
Attorney, Agent or Firm:
Hisako Ishido (3 outside)