To provide a substrate treatment device having good workability when maintenance is performed, and having high flexibility in the arrangement of treatment units.
A unit arrangement section 10 is provided with a chemical cabinet 11 on the bottom. Above the chemical cabinet and at four corners of a device, coating treatment units SC1, SC2 to form a resist coat on a substrate as a liquid treatment unit, and development treatment units SD1, SD2 to perform development to the substrate after exposure, are located. In the center, a substrate carrying means TR1 rotatable around a perpendicular shaft is located. Additionally, on upper sides of these liquid treatment units, multistage heat treatment units 20 to heat-treat a substrate are located at a front section and a rear section of the device. And also, on the front side of the device and between the coating treatment units SC1, SC2, a cleaning treatment unit SS as a substrate treatment unit to apply washing such as pure water to the substrate, and to clean the substrate is located.
IMANISHI YASUO
TSUJI MASAO
KAWAMOTO TAKANORI
IWAMI MASAKI
NISHIMURA JOICHI
MORITA AKIHIKO
Yoshitake Hidetoshi
Takahiro Arita
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