To provide substrate treatment equipment in which the in-plane uniformity of plasma treatment is enhanced for a substrate being treated without complicating structure.

The substrate treatment equipment comprises a pair of electrodes 323 and 324 provided in a treatment chamber 201 in order to plasma-exciting gas for treating a substrate 200 where a substrate is mounted on at least one electrode, a means 308 for supplying high frequency power to a pair of the electrodes, a means 331 for rotating the pair of electrodes, and a section 332 for controlling at least the rotating means and the high frequency power supplying means so that high frequency power supply to the pair of electrodes is stopped when the pair of electrodes are rotated by the rotating means, and high frequency power is supplied to the pair of electrodes when the pair of electrodes are stopped.