Title:
SUBSTRATE FOR USE IN CHIP TYPE LED PACKAGE
Document Type and Number:
Japanese Patent JP2010114427
Kind Code:
A
Abstract:
To provide a substrate which has an extremely small linear expansion coefficient of an insulation layer in the surface direction thereof while having a practically sufficient heat resistance, and is excellent for use in a chip type LED package.
An electrically conductive layer 2, an insulation layer 1, and a heat-dissipation plate 3 are laminated in this order. The insulation layer 1 is formed of a liquid-crystal polyester soluble in a solvent and a sheet composed of inorganic fibers and/or organic fibers. The laminated member thus obtained is used as a substrate for a chip type LED package. Preferably, the insulation layer 1 contains an inorganic filler.
Inventors:
CHIN SHOHO
ITO TOYOMASA
OKAMOTO SATOSHI
ITO TOYOMASA
OKAMOTO SATOSHI
Application Number:
JP2009220387A
Publication Date:
May 20, 2010
Filing Date:
September 25, 2009
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO
International Classes:
H01L33/52
Domestic Patent References:
| JP2006001959A | 2006-01-05 | |||
| JP2005086044A | 2005-03-31 | |||
| JP2007129188A | 2007-05-24 |
Attorney, Agent or Firm:
Toru Nakayama
Toru Sakamoto
Toru Sakamoto
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