Title:
SUBSTRATE USED FOR PACKAGING HIGH-FREQUENCY RELAY, AND METHOD THEREFOR
Document Type and Number:
Japanese Patent JP3462149
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve the isolation characteristics between high-frequency terminals by preventing the leakage of a signal between the high-frequency terminals when packaging a lead-terminal high-frequency relay to a printed- circuit board.
SOLUTION: This substrate for packaging a lead-terminal high-frequency relay is provided with a first hole where the high-frequency terminal of the lead-terminal high-frequency relay passes through, a first planar grounding part that is formed on the surface of the substrate with a gap to the outer periphery of the first hole, a first conductive part that is formed at the outer periphery of the first hole on the rear surface of the substrate, a second planar grounding part that is formed with a gap to the outer periphery of the first conductive part on the rear surface of the substrate, a second hole that is punched between the first conductive parts, and a second conductive part that is formed at the inner-periphery side of the second hole and electrically short- circuit the first planar grounding part of the surface of the substrate and the second planar grounding part on the rear surface of the substrate.
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Inventors:
Masaaki Yano
Toshiya Momochi
Toshiya Momochi
Application Number:
JP2000150917A
Publication Date:
November 05, 2003
Filing Date:
May 23, 2000
Export Citation:
Assignee:
Shimada Rika Co., Ltd.
International Classes:
H05K1/18; H01H45/04; H01P1/10; H05K1/02; (IPC1-7): H05K1/02; H01P1/10; H05K1/18
Domestic Patent References:
| JP57134885U | ||||
| JP6380873U |
Attorney, Agent or Firm:
Junichi Ueshima
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