Title:
SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
Japanese Patent JP2007110095
Kind Code:
A
Abstract:
To provide a substrate with a built-in electronic component with improved yield, and a method for manufacturing the same.
A second substrate 12 is provided above a first substrate 11, an electronic component 13 is arranged between the first substrate 11 and the second substrate 12 so that the electronic component 13 is sealed between the first substrate 11 and the second substrate 12, and a photosensitive resin 14 having adhesion properties is provided to bond the first substrate 11 and the second substrate 12 to each other.
Inventors:
HARUHARA MASAHIRO
Application Number:
JP2006244210A
Publication Date:
April 26, 2007
Filing Date:
September 08, 2006
Export Citation:
Assignee:
SHINKO ELECTRIC IND CO
International Classes:
H05K3/46; H05K1/14
Domestic Patent References:
| JP2003197849A | 2003-07-11 | |||
| JP2003124250A | 2003-04-25 |
Attorney, Agent or Firm:
Tadahiko Ito