To provide a substrate processing apparatus easily varying an angle of a substrate based on a horizontal plane when processing the substrate.
A treatment space 38 is formed in a treatment tank 33. A substrate holding part 34, first and second washing solution spraying nozzles 41a, 41b, and first and second drying gas jetting nozzles 42a, 42b are positioned in the treatment space 38. The substrate holding part 34 holds a substrate 32 in the treatment space 38. The first and second washing solution spraying nozzles 41a, 41b spray the washing solution onto the substrate 32. The first and second drying gas jetting nozzles 42a, 42b jet the drying gas onto the substrate 32. An attitude changing means 37 changes the attitude of the treatment tank 33. As the attitude of the treatment tank 33 changes, the attitudes of the substrate holding part 34, respective nozzles 41a, 41b, 42a, 42b provided in the treatment space 38 change.
YAMAMOTO YUICHI
MORI YUZO
MORI YUZO
Takeshi Sugiyama
Minetarou Hirose
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