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Title:
SUCTION APPARATUS, SUCTION UNIT, MOUNTING DEVICE, AND SUCTION AND MOUNTING METHOD OF CONDUCTIVE MEMBER, SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3654135
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a suction device of a conductive member that can efficiently conduct suction of the conductive member.
SOLUTION: This suction device of a conductive member is equipped with a suction apparatus 110 with a suction unit 112 for sucking a conductive member 100, and force supply equipment 120. The force supply equipment 120 applies force that maintains the suction state, when one conductive member 100 is sucked by the suction part 112, and at the same, time releases the suction state of the conductive member 100, when two conductive members 100 are sucked by the suction unit 112.


Inventors:
Masakuni Shiozawa
Tomoyuki Shindo
Application Number:
JP2000141199A
Publication Date:
June 02, 2005
Filing Date:
May 15, 2000
Export Citation:
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Assignee:
Seiko Epson Corporation
International Classes:
H01L21/60; B23K3/06; H01L21/683; H05K3/34; H01L21/48; (IPC1-7): H01L21/60; B23K3/06; H05K3/34
Domestic Patent References:
JP8139093A
JP9162533A
JP2000012593A
JP9223713A
JP10200249A
Attorney, Agent or Firm:
Inoue Ichi
Yukio Fuse
Mitsue Obuchi