PURPOSE: To clean to eliminate grinding chips almost completely by disposing porous ceramic and brushes for cleaning grinding chips remaining in the top surface of a suction chuck under a rotary shaft for cleaning.
CONSTITUTION: A rotary shaft 7 for cleaning is rotated and revolved by drive of a drive motor 3. Grinding chips remaining in the top surface of a suction chuck are removed by brushes 9 of a group of brush beams 10 fixed radially at the lower end of this rotary shaft 7 after grinding a semiconductor wafer. Removed grinding chips are then take off by porous ceramic 11 of a group of ceramic beams 12 radially fixed at the lower end of this rotary shaft 7 between the brush beams 10, so the suction chuck is cleaned uniformly almost completely.