Title:
SUCTION CHUCK CLEANING DEVICE FOR SEMICONDUCTOR WAFER GRINDING MACHINE
Document Type and Number:
Japanese Patent JPH01171762
Kind Code:
A
Abstract:
PURPOSE:To clean to eliminate grinding chips almost completely by disposing porous ceramic and brushes for cleaning grinding chips remaining in the top surface of a suction chuck under a rotary shaft for cleaning. CONSTITUTION:A rotary shaft 7 for cleaning is rotated and revolved by drive of a drive motor 3. Grinding chips remaining in the top surface of a suction chuck are removed by brushes 9 of a group of brush beams 10 fixed radially at the lower end of this rotary shaft 7 after grinding a semiconductor wafer. Removed grinding chips are then take off by porous ceramic 11 of a group of ceramic beams 12 radially fixed at the lower end of this rotary shaft 7 between the brush beams 10, so the suction chuck is cleaned uniformly almost completely.
Inventors:
KOBAYASHI KAZUO
Application Number:
JP32945087A
Publication Date:
July 06, 1989
Filing Date:
December 28, 1987
Export Citation:
Assignee:
SHIBAYAMA KIKAI KK
International Classes:
H01L21/304; B23Q11/00; B24B55/02; (IPC1-7): B23Q11/00; B24B55/02; H01L21/304