Title:
SUCTION PAD
Document Type and Number:
Japanese Patent JP2003145473
Kind Code:
A
Abstract:
To prevent any deflection, troubles, or the like in a movable arm or the like to support a suction pad by reducing the weight of the suction pad to such and carry a plate-like article such as a semiconductor wafer.
In the suction pad 1 having at least a suction unit 7 to suck and hold the plate-like article and a frame 8 to surround the suction unit, the suction unit 7 and the frame 8 are formed of porous ceramic, and a shielding film 8a to prevent any air leakage is applied to the frame 8.
Inventors:
YAMANAKA SATOSHI
MURAKAMI TOMOTAKA
MURAKAMI TOMOTAKA
Application Number:
JP2001347601A
Publication Date:
May 20, 2003
Filing Date:
November 13, 2001
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B25J15/06; B65G49/07; H01L21/677; H01L21/68; (IPC1-7): B25J15/06; B65G49/07; H01L21/68
Attorney, Agent or Firm:
Isao Sasaki (1 person outside)
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