PURPOSE: To prevent a decrease in a strength of an IC chip without damaging a flat surface of a board when the board is a wafer by forming a suction surface of a suction pad for sucking the surface of the board of resin.

CONSTITUTION: A suction pad 10A has its periphery 13 and a suction surface 11 covered with resin including a vacuum groove 12 for sucking a wafer 1. As the resin, Teflon is, for example, used. The periphery 13 and the surface 11 are covered uniformly in a thickness of about 30μm and baked. At least a head of the pad 10A may be formed of resin having low hardness. When such a pad 10A is used to suck and hold a rear surface of the wafer and the pad 10A is rotated in order to match orientation flat parts, a concentric damage is not formed on the rear surface of the wafer 1 even if the surface 11 of the pad 10A is deviated from the rear surface of the sucked wafer 1.