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Title:
SUPER ABRASIVE GRAIN GRINDING WHEEL AND GRINDING METHOD
Document Type and Number:
Japanese Patent JPH07112371
Kind Code:
A
Abstract:

PURPOSE: To provide super abrasive grain grinding wheel and a grinding method wherein grinding is practicable even at a limited space and a grinding work is practicable in succession for a long time.

CONSTITUTION: In a grinding wheel having a super abrasive grain layer 5 and a base layer 6, the base layer is formed in a manner to protrude from the super abrasive grain layer toward the work (a chip 10) side. In grinding, the base layer 6 is first collided with the work and the surface of the base layer is deleted approximately by an amount of a cut work. Grinding of the work is effected by the super abrasive grain layer 5 protruded through deletion. The shearing force of the base layer is set to 0.4-1.2kg/mm2 so that deletion of the base layer 6 is facilitated.


Inventors:
MAEJIMA TOYOHIRO
FURUTA SUSUMU
INAMOTO KEIGO
Application Number:
JP28582593A
Publication Date:
May 02, 1995
Filing Date:
October 20, 1993
Export Citation:
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Assignee:
OSAKA DIAMOND IND
International Classes:
B23D63/14; B24D3/00; B24D7/00; (IPC1-7): B24D7/00; B23D63/14; B24D3/00
Domestic Patent References:
JPS58172851A1983-10-11
Attorney, Agent or Firm:
Hidemi Aoki (1 outside)