Title:
SUPERCONDUCTING WIRING
Document Type and Number:
Japanese Patent JPH01120845
Kind Code:
A
Abstract:
PURPOSE:To contrive speeding up of switching speed without being affected by wiring resistance, by performing electrode wiring of a semiconductor device with a ceramic high temperature superconducting film and forming a material film or alloy film at a part, either lower face or upper face which comes into contact with a semiconductor of a high temperature superconducting film. CONSTITUTION:A diffusion layer 2 and insulating film 3 are formed at the surface of a semiconductor substrate 1 and a contact hole is made at the upper part of the diffusion layer 2 of the insulating film 3. And an alloy film consisting of MoSi, TiSi, TiN, WSi and the like is formed as base metallic wiring 4 at the upper plane including the above contact hole at least. Subsequently, ceramic superconducting wiring 5 consisting of YBaSrCuO and the like is formed at the upper part of base metallic wiring 4. This situation makes it possible to perform superconducting wiring towards the semiconductor device and prevents the delay of a switching speed due to wiring resistance in the semiconductor device.
Inventors:
IWAMATSU SEIICHI
Application Number:
JP27855287A
Publication Date:
May 12, 1989
Filing Date:
November 04, 1987
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
H01L39/06; H01L21/3205; H01L23/52; (IPC1-7): H01L21/88; H01L39/06
Attorney, Agent or Firm:
Mogami (1 person outside)