To provide a superposition measurement device wherein, for such case as temperature condition being different between when coordinate offset is measured and when wafer is measured, a stage can be so moved that the center of optical axis of a microscope and the center of a measurement mark are accurately aligned.

A thermometer 9 for measuring a temperature near a stage and a coordinate off-set correction part 10 for outputting a movement amount commanding value corrected, based on a temperature information of the thermometer 9 to a stage of a superposition measurement device are provided, and the stage is moved based on the corrected movement amount commanding value, so that the center position of optical axis of a microscope is aligned with the center position of measurement mark on a wafer.