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Patent Searching and Data


Title:
SUPERSONIC WIRE BONDING
Document Type and Number:
Japanese Patent JPS6372135
Kind Code:
A
Abstract:

PURPOSE: To enable bonding of a wire orientated in all directions, by using a flexible member to form a cavity oscillated by supersonic waves and vibrating a capillary so as to be deformed and converting the vertical vibration into the orthogonal vibration, so that the capillary is vibrated in all circumferential directions.

CONSTITUTION: Against a bonding position of a pellet 19 on a frame 18 attracted by an attracting pad 15 on a table position-controlled by a controller, a supersonic oscillating device 3 is operated in a state where a capillary 9 touches the device through a wire 12, and the capillary 9 is vibrated through a horn 5 in the direction of an arrow B. A pointed end of the capillary 9 touches a pad 22 of the pellet 19 through the wire 12 and it is repeatedly deformed in the direction of an arrow C. Thus the wire 12 is vibrated by the capillary 9 aud a bonding operation is completed. Hence, using the capillary enables the vibration to be orthogonally changed in the circumferential directions and makes the wire be vibrated to perform the bonding operation, and so the wire can be connected in all directions and bonding-work hours can be shortened.


Inventors:
MITA TORU
TAKAHASHI MICHIRO
ARAI SHINICHI
OZAWA MASAKAZU
TANI MITSUKIYO
Application Number:
JP21573886A
Publication Date:
April 01, 1988
Filing Date:
September 16, 1986
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
H01L21/607; H01L21/60; (IPC1-7): H01L21/607
Attorney, Agent or Firm:
Katsuo Ogawa