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Title:
SUPPLEMENTARY METHOD FOR HIGH VISCOSITY AGENT FOR FITTING SURFACE MOUNTING PARTS
Document Type and Number:
Japanese Patent JPS6397359
Kind Code:
A
Abstract:

PURPOSE: To prevent air contamination and to reduce the generation of defects in soldering by giving resistance to the flow to the other end side of a syringe with supplying a high viscosity agent with its pressurizing from one end in the longitudinal direction of the syringe and diffusing it in the radial direction of the syringe.

CONSTITUTION: An adhesive extruding device 3 is provided with a discharging port 4a at the front part and a freely movable in parallel bottom plate 4b at the rear part, and the holding part 3a holding the tube 4 in which the adhesive A for supply is stored, the trigger 3c giving pressing force to the disk 3b pressing the bottom plate 4b and the member 3d locking the disk 3b are taken as its component. In case of supplying the adhesive 1 inside a syringe 1 by using such extrusion device 3, an adhesive regulating jig 6 gives resistance to the flow to the other end side of the syringe 1 of the adhesive A to which the adhesive A left in sticking state at the discharging side 1a of the syringe 1 and the adhesive A is diffused in the radial direction, so the supply of the adhesive in such state as a snake coiling up is eliminated and no air is contaminated as well.


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Inventors:
GOTO MASAMI
Application Number:
JP24074786A
Publication Date:
April 28, 1988
Filing Date:
October 09, 1986
Export Citation:
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Assignee:
FUJI KAGAKU SANGYO KK
International Classes:
B23K3/06; B65B3/04; H05K3/34; (IPC1-7): B23K3/06
Attorney, Agent or Firm:
Kitamura Osamu



 
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