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Title:
SUPPORT METHOD FOR ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JPH05226957
Kind Code:
A
Abstract:

PURPOSE: To suppress the dispersion in, e.g. a vibration characteristic of a piezoelectric element by parting a base and the electronic component by a prescribed interval at all times and fixing and supporting the component in a floating form thereby making the operating environment of the electronic component constant.

CONSTITUTION: A rectangular thermal contraction resin 4 having a preset height is placed at first onto a prescribed position on a board 2 having electrode sections 1 at its left and right sides. The height of the thermal contraction resin 4 is a prescribed height depending on the vibration characteristic of the piezoelectric element. Then the electronic component 3 to both upper and lower sides of which an element electrode 5 is provided is placed on the thermal contraction resin 4 and then a conductive resin paste 6 is coated to fix and support the board 2 and the electronic component 3 and solidified. Finally the thermal contraction resin 4 is heated to be contracted and formed ideally to be hollow, in which the electronic component 3 is fixed and supported.


Inventors:
MATSUMOTO IKUO
Application Number:
JP2557792A
Publication Date:
September 03, 1993
Filing Date:
February 13, 1992
Export Citation:
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Assignee:
ROHM CO LTD
International Classes:
H03H9/05; H03H9/02; H05K3/30; H05K3/32; (IPC1-7): H03H9/02; H03H9/05
Attorney, Agent or Firm:
Nakamura Shigenobu



 
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