Title:
サポートプレート
Document Type and Number:
Japanese Patent JP5271554
Kind Code:
B2
Abstract:
The present invention provides a support plate (1) that bonds to a substrate (2) so as to support the substrate (2). In the support plate (1), a plurality of openings (15) and (15') penetrate through from a bonding surface to a non-bonding surface, the bonding surface facing the substrate (2), and the non-bonding surface facing the bonding surface; a porous region (13), which includes a first region (11) and a second region (12) surrounding the first region, is formed on the bonding surface; and the first region (11) has an opening ratio greater than that of the second region (12). By this, it is possible to realize a support plate that can be easily peeled off from a semiconductor wafer with a solvent, but does not easily come off from a substrate during a processing operation on the semiconductor wafer.
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Inventors:
Atsushi Miyanari
Application Number:
JP2008024033A
Publication Date:
August 21, 2013
Filing Date:
February 04, 2008
Export Citation:
Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
H01L21/683; H01L21/02
Domestic Patent References:
| JP2002059363A | ||||
| JP2008021929A | ||||
| JP2004335655A | ||||
| JP6275717A | ||||
| JP61208842A | ||||
| JP2004079784A |
Attorney, Agent or Firm:
Kenzo Hara International Patent Office
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