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Patent Searching and Data


Title:
支えられたセンサ組立体
Document Type and Number:
Japanese Patent JP5301210
Kind Code:
B2
Abstract:
Various methods and devices are provided for removably coupling a sensor assembly to a catheter to measure conditions surrounding the catheter when the catheter is implanted in a patient. In one embodiment, a modular sensor assembly is provided and includes a housing having an antenna therein adapted to be removably coupled to at least a portion of a catheter. The housing can be a closed loop having an opening therethrough. One or more sensors can be coupled to the antenna for measuring conditions surrounding the catheter when the catheter is implanted in a patient. In one embodiment, the housing can be adapted to removably couple to a distal end of the catheter, and the opening of the housing can be adapted to receive the catheter. The antenna can be a loop disposed within the housing.

Inventors:
Alan Dextradew
Stephan wilson
Daniel McCasker
Application Number:
JP2008168887A
Publication Date:
September 25, 2013
Filing Date:
June 27, 2008
Export Citation:
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Assignee:
Codman & Shurtleff, Inc.
International Classes:
A61B5/00; A61B5/01
Domestic Patent References:
JP2005131369A
JP2005537111A
JP2006255422A
Foreign References:
US20060020239
US5704352
US20090005701
EP2008583A1
Attorney, Agent or Firm:
Konobu Kato