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Title:
支持ガラス基板及びこれを用いた積層基板
Document Type and Number:
Japanese Patent JP7265224
Kind Code:
B2
Abstract:
A support glass substrate according to the present invention is characterized by having an average linear thermal expansion coefficient of 30 × 10-7 to 55 × 10-7/°C inclusive in a temperature range from 30 to 380°C and a Young's modulus of 80 GPa or more.

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Inventors:
Tetsuya Murata
Miku Fujii
Ryota Suzuki
Application Number:
JP2019532431A
Publication Date:
April 26, 2023
Filing Date:
June 15, 2018
Export Citation:
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Assignee:
Nippon Electric Glass Co., Ltd.
International Classes:
C03C3/087; C03C3/091; C03C3/093; C03C3/095; H01L21/683; H01L23/12; H01L23/15; H01L23/29; H01L23/31
Domestic Patent References:
JP2016169141A
JP2004531443A
Foreign References:
WO2016190303A1



 
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