Title:
表面実装技術処理設備における上下方向に分離されたパススルーコンベアシステムおよび方法
Document Type and Number:
Japanese Patent JP2012509598
Kind Code:
A
Abstract:
Disclosed herein is an apparatus for depositing viscous material on an electronic substrate. The apparatus comprises a frame, an assembly material applicator coupled to the frame and configured to apply assembly material to the electronic substrate, a substrate support assembly, coupled to the frame, configured to support and secure the electronic substrate in a material application position, and a transport system, coupled to the frame, to shuttle electronic substrates to and from the substrate support assembly, the transport system including an upper track and a lower track disposed below the upper track.
Inventors:
Doyle, Dennis Gee.
Application Number:
JP2011537504A
Publication Date:
April 19, 2012
Filing Date:
November 12, 2009
Export Citation:
Assignee:
Illinois Tours Works Inc.
International Classes:
B41F15/08; H05K3/34; B41F15/12; B41F15/26
Domestic Patent References:
| JP2004142299A | 2004-05-20 | |||
| JP2006339238A | 2006-12-14 | |||
| JP2001047600A | 2001-02-20 | |||
| JP2001315310A | 2001-11-13 | |||
| JPH06166166A | 1994-06-14 | |||
| JP2002515655A | 2002-05-28 |
Attorney, Agent or Firm:
Atsushi Aoki
Tetsuro Shimada
Shinji Mitsuhashi
Koichi Ito
Kentaro Ito
Tatsuki Sone
Tetsuro Shimada
Shinji Mitsuhashi
Koichi Ito
Kentaro Ito
Tatsuki Sone