To provide a surface acoustic wave device of high sealing reliability and high mass production, by suppressing the effect of an alloy layer poor in solder sealing on an abutment surface when temporary fixing using ultrasonic heat-compression bonding to seal and connect an acoustic wave element to a base substrate using solder, and to provide its manufacturing method.
Ultrasonic heat-compression bonding is carried out by abutting a connection electrode 12 and a circumference sealing electrode 13 formed on one main surface of a piezoelectric substrate 10, with a solder bump 3 and a solder joint material 4 formed on the surface of an element connection electrode 21 and a circumference sealing film 22 on an associated base substrate 2 by solder melted in advance. At that time, the abutting is conducted with the top of the solder of the circumference sealing film 22 is placed outside the circumference sealing electrode 13.
TOUDEN MITSUTAKA
OIKAWA AKIRA
YAMANO MASARU
