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Title:
SURFACE ACOUSTIC WAVE DEVICE
Document Type and Number:
Japanese Patent JP2011166259
Kind Code:
A
Abstract:

To provide a surface acoustic wave device which uses leakage surface acoustic waves, and is capable of increasing a sound speed and easily achieving a frequency increase.

In the surface acoustic wave device 1, an IDT electrode 3 is formed on an LiNbO3 substrate 2, a silicon oxide film 6 is formed so as to cover the IDT electrode 3 on the LiNbO3 substrate 2, and a dielectric layer 7 is formed on the silicon oxide film 6. The transverse wave speed of the dielectric layer 7 is higher than a slow transverse wave velocity in LiNbO3, and when the film thickness of the dielectric layer 7 is defined as H3, a normalized film thickness H3/λ normalized by the wavelength λ of the leakage surface acoustic waves lies in the range of 0.25-0.6.


Inventors:
OKADA KEIJI
KIDO SHUNSUKE
Application Number:
JP2010023952A
Publication Date:
August 25, 2011
Filing Date:
February 05, 2010
Export Citation:
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Assignee:
MURATA MANUFACTURING CO
International Classes:
H03H9/145; H03H9/25
Attorney, Agent or Firm:
宮▲崎▼ 主税



 
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