To provide a surface acoustic wave device which can ensure desired frequency characteristics by making the inductance component adjustable easily without causing increase in cost or development period or deterioration of the characteristics.

The surface acoustic wave device is provided with, in a package 2, a plurality of package side GND electrodes 21, 22, and 23 connectable with a GND electrode 11 of an SAW chip 1 and disposed so that the line lengths from an interdigital electrode 19 are different, and a plurality of package side GND electrodes 24, 25, and 26 connectable with a GND electrode 12 of the SAW chip 1 and disposed so that the line lengths from an interdigital electrode 18 are different. The GND electrodes 11 and 12 of the SAW chip 1 and one or a plurality of corresponding package side GND electrodes are connected by flip-chip bonding so that the inductance between a parallel resonator and a ground level has a desired value.