To minimize a mechanical stress on a lead wire with minimum material cost and to reduce height of a package main body, by allowing pin thickness of a lead frame to be the same as a main pad part, and forming a bending part of the pin inside a mold housing, etc.

A lead frame is provided with a main pad part 24 comprising a part which, supporting a semiconductor die 18, extends from its edge part to the outside of a mold housing 20. Further, two or more independent pins 22 are provided which comprise such part as, assigned along the opposite edge of the main pad part 24, extending outside from the mold housing 20 and a bonding pad part. Each pin 22 has the same thickness as the main pad part 24 while comprising its bending part inside the mold housing 20. The bonding pad part rises above the main pad part 24, and such part as extending outside from the mold housing 20 is as tall as the main pad part 24.