Title:
SURFACE MOUNT TYPE ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JPH0685153
Kind Code:
A
Abstract:
PURPOSE: To prevent deformation of a lead terminal of a surface mount type electronic component and enhance the reliability of a soldered area of the lead terminal as well.
CONSTITUTION: A lead terminal 2 pulled out from a package main body 1 is formed with a conductive ultra-elastic alloy while a U-shaped bending portion 2a, whose bending angle is acute, is formed in the intermediate part of the lead terminal 2 as well. A greater part of differential thermal expansion between the package main body 1 and a board 3 produced by the drive of an electronic component can be absorbed by elastic deformation of the U-shaped bending portion of the lead terminal 2a, which protects a soldered part 8 from the action of a large stress.
Inventors:
TSUMORI MASAHIKO
Application Number:
JP26302892A
Publication Date:
March 25, 1994
Filing Date:
September 03, 1992
Export Citation:
Assignee:
ROHM CO LTD
International Classes:
H01L23/50; H05K1/18; H05K3/34; (IPC1-7): H01L23/50
Attorney, Agent or Firm:
Tsutomu Sugitani
Next Patent: 中間バッファ制御方式