To provide a surface mount type light-emitting device which has a resin mold obtained by hardening a thermosetting resin composition by transfer molding and has the resin mold and a light-transmissive sealing resin hardly peeled off each other, and a method for manufacturing thereof.
A surface mount type light-emitting device 1 includes a support member 20 having a recess 20c comprising a bottom surface 20a and a wall surface 20b, an optical semiconductor element (light emitting element) 10 provided in the recess 20c, and a sealing resin portion 11 which fills the recess 20c to seal the optical semiconductor element 10. The support member 20 includes: a first lead portion 14a and a second lead portion 14b electrically connected to the optical semiconductor element 10; and a resin mold 13 comprising a mold which forms at least a part of the wall surface 20b of the recess 20c and is formed by transfer molding of pouring the thermosetting resin composition into a mold and hardening it by heating and is not hardened again by heating after being removed from the mold.
KOTANI ISATO
MIZUTANI MASATO
| JP2006140207A | 2006-06-01 | |||
| JP2006156704A | 2006-06-15 |
Yoshinori Shimizu
Hideki Okita