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Title:
SURFACE MOUNT TYPE LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THEREOF
Document Type and Number:
Japanese Patent JP2009272616
Kind Code:
A
Abstract:

To provide a surface mount type light-emitting device which has a resin mold obtained by hardening a thermosetting resin composition by transfer molding and has the resin mold and a light-transmissive sealing resin hardly peeled off each other, and a method for manufacturing thereof.

A surface mount type light-emitting device 1 includes a support member 20 having a recess 20c comprising a bottom surface 20a and a wall surface 20b, an optical semiconductor element (light emitting element) 10 provided in the recess 20c, and a sealing resin portion 11 which fills the recess 20c to seal the optical semiconductor element 10. The support member 20 includes: a first lead portion 14a and a second lead portion 14b electrically connected to the optical semiconductor element 10; and a resin mold 13 comprising a mold which forms at least a part of the wall surface 20b of the recess 20c and is formed by transfer molding of pouring the thermosetting resin composition into a mold and hardening it by heating and is not hardened again by heating after being removed from the mold.


Inventors:
URASAKI NAOYUKI
KOTANI ISATO
MIZUTANI MASATO
Application Number:
JP2009076722A
Publication Date:
November 19, 2009
Filing Date:
March 26, 2009
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
H01L23/28; H01L23/29; H01L23/31; H01L33/48; H01L33/50; H01L33/56; H01L33/60; H01L33/62
Domestic Patent References:
JP2006140207A2006-06-01
JP2006156704A2006-06-15
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hideki Okita