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Title:
SURFACE MOUNT TYPE SEMICONDUCTOR PACKAGE CARRIER JIG
Document Type and Number:
Japanese Patent JPH06211286
Kind Code:
A
Abstract:

PURPOSE: To perform functions as a stick magazine and a tray, by providing a plurality of magazine insertion openings, and by providing pocket closing members which are erected and bent around the rows of pockets, thereby closing the openings of the pockets and making it possible to place semiconductor packages.

CONSTITUTION: In a carrier jig 1, a plurality of openings, 2A and 2B, into which surface mount type semiconductor packages can be inserted in a horizontal direction are disposed at proper intervals; a plurality of pockets, 3, are also disposed in rows at proper intervals. These pockets 3 are open in the upper directions, and grooves 4 are provided around them. A pocket closing member 5 is erected in this groove 4. The opening of the pocket 3 is closed by bending the upper half of the closing member 5. This makes it possible to place the packages supplied in a vertical direction, and to use the jig both as a magazine stopper, capable of performing a function as a stopper, and a tray.


Inventors:
HIRANO TORU
Application Number:
JP8365592A
Publication Date:
August 02, 1994
Filing Date:
April 06, 1992
Export Citation:
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Assignee:
HITACHI LTD
HITACHI TOKYO ELECTRONICS
International Classes:
B65D85/00; B65D85/38; B65D85/86; H01L21/673; H01L21/68; H05K13/02; (IPC1-7): B65D85/38; B65D85/00; H01L21/68; H05K13/02
Attorney, Agent or Firm:
Ogawa Katsuo



 
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