Title:
表面実装可能な光電子式の構成素子
Document Type and Number:
Japanese Patent JP5108247
Kind Code:
B2
Abstract:
The component has a housing (1) that has two housing sides (15,16) extending from a housing surface area (9). The housing surface area has connection portions (7) attached to a substrate (2) with the use of solder (10). Recesses (11) are formed adjacent the connection portions of the housing, such that outer and inner solder portions (17,18) are formed surrounding the connection portions. The recesses are formed with tapered, V-shaped or trapezoidal cross-sections. A semiconductor chip (24) is mounted on the housing.
Inventors:
Christian feastle
Application Number:
JP2006111810A
Publication Date:
December 26, 2012
Filing Date:
April 14, 2006
Export Citation:
Assignee:
Osram Opto Semiconductors GmbH
International Classes:
H01L33/52; H01L33/48; H01L33/62
Domestic Patent References:
| JP5347435A | ||||
| JP2005079329A | ||||
| JP2000196000A | ||||
| JP1097519U | ||||
| JP2000216440A | ||||
| JP1174912U |
Foreign References:
| WO2004077558A1 |
Attorney, Agent or Firm:
Toshio Yano
Takuya Kuno
Einzel Felix-Reinhard
Takuya Kuno
Einzel Felix-Reinhard