SURFACE MOUNTING METHOD OF PRINTED WIRING BOARD

Japanese Patent JP3241525

B2

PURPOSE: To protect a printed wiring board against solder bridges and deterioration in soldering reliability due to a shortage of solder by a method wherein adhesive agent is applied onto the one side of the printed wiring board, and flux of high viscosity is applied onto the other side of the printed wiring board so as to preliminarily fix a surface-mounting part to a pad, flux is applied onto the side of the printed wiring board which faces downwards, and then a reflow soldering operation is carried out.
CONSTITUTION: A surface-mounting part 56 is mounted on the surface A of a printed wiring board 10A, and the leads 58 of the part 56 are aligned with pads 12 and bonded with adhesive agent 54, The printed wiring board 10A is turned upside down so as to make its surface B face upwards, flux 60 of high viscosity is applied onto solder plating layers 52 located on pads 14 on the surface B, and a part 62 is preliminarily fixed to the surface B. Flux is applied onto the underside A of the wiring board 10A by a flux applying device 66, and the wiring board 10A is loaded into a reflow oven making its surface B face upwards, whereby the leads 58 and 64 of the parts 56 and 62 are soldered to the pads 12 and 14 through a reflow soldering method. By this s setup, solder can be very accurately controlled in feeding quantity and position.

Tomoka Nakagawa
Kazuo Uchiyama

JP6542094A

December 25, 2001

March 10, 1994

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Nippon Avionics Co., Ltd.

H05K3/34; H05K3/30; (IPC1-7): H05K3/34

JP4199780A
JP5327198A

Fumio Yamada (1 person outside)

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