PURPOSE: To provide a surface mounting method of semiconductor component in which reliability is enhanced in the connection between lead and pad.
CONSTITUTION: When a semiconductor component is mounted on a circuit board by applying cream solder 10 onto pads 6 arranged on the surface of a circuit board 5 and then subjecting the pads 6 and the leads 3 of the semiconductor component to reflow soldering, a bonding tool 40 comprising a frame body 41 having stepped H end face 45 is employed after temporarily mounting a semiconductor component 1 on the circuit board 5 while aligning the seat part 3A of the lead 3 with a corresponding pad 6. Top face of the seat part 3A is then pressed by the inner stepped end face 47 of the bonding tool 40 to abut the outer peripheral stepped end face 46 on the surface of the circuit board 5 thus reflow soldering the leads 3 and the pads 6.
KOGURE SEIJI
KOBAYASHI YASUSHI
