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Title:
SURFACE MOUNTING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH0287654
Kind Code:
A
Abstract:

PURPOSE: To prevent a protruding part tor fixation use on a mounting board from falling off when it is passed through a soldering tank by a method wherein the protruding part for fixation use is provided with a groove, for fixation use, which is coupled mechanically to the mounting board and is used to prevent the board from being detached and a difference in a size between a face closest to a sealing resin body of the groove and a face closest to the board of an external lead is specified.

CONSTITUTION: A protruding part 3 for fixation use is provided with a groove 4 for fixation use of a carved structure coupled mechanically to a mounting board 5. During this process, a difference δ in size between a face coming into contact with the board 5 of an external lead 2 and a bonding face of the groove 4 for fixation use and the board 5 is set at 0.1 to 0.3mm.


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Inventors:
KOBAYASHI YASUHISA
Application Number:
JP24147588A
Publication Date:
March 28, 1990
Filing Date:
September 26, 1988
Export Citation:
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Assignee:
NEC CORP
International Classes:
H05K1/18; H01L23/28; H05K3/30; H05K3/34; (IPC1-7): H01L23/28; H05K1/18
Attorney, Agent or Firm:
Uchihara Shin



 
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